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2017-09-08
The 2017 “Taiwan-U.S.A. Industrial Cooperation Mission” led by Mr. Yu, Cheng-Wei, Deputy Director General of the Industrial Development Bureau, Ministry of Economic Affairs arrived in Boise, capital of Idaho State on August 30 (local time) and visited the Idaho State Government, the Idaho Department of Commerce, as well as memory giant Micron Technologies. The delegation urged the company to expand its investment in Taiwan. In addition, the delegation signed three MOUs with Boise State University (BSU) on talent cultivation for smart manufacturing and Internet of things.
The delegation, led by Mr. Yu and consisting of members from the industry, government and academia met with Brad Little, Lieutenant Governor of Idaho, and Ms. Megan Ronk, Director of Idaho Department of Commerce and was warmly welcomed. According to Mr. Yu, Taiwan is the fourth largest trading partner of Idaho, and the State and Taiwan signed a memorandum of industrial cooperation in 2015 covering green energy, semiconductor, aerospace and innovation entrepreneurship. Through the model of “to build up public platform for the privates to perform”, industrial exchanges between both sides have been very frequent as cross-investment between Micron Technologies and Nanya Technology Corporation of the Formosa Plastics Group was realized in last December. Mr. Yu hoped that the cooperation would be strengthened and invited people from all sectors from Idaho to form delegations to visit Taiwan.
The delegation also visited Micron Technologies. Micron Technologies is the world's third largest memory maker, next only to South Korea's Samsung and Hynix. It is also the largest foreign investor of Taiwan, with plants established in Taoyuan and Taichung employing about 5,280 people, and planning to hire another 1,000 people. Micron expressed that Taiwan's semiconductor industry is very strong with the industry cluster second to none and is the best partner of Micron Technologies. Mr. Yu expressed hope for Micron Technologies to continue to expand investment and cooperation in Taiwan, building a complete supply chain to make Taiwan a Micron's hub of DRAM in the world.
Another major result of the trip was the signing of MOUs with Boise State University and Providence University, NEXCOM International and the Industrial Technology Research Institute (ITRI). The signing ceremony was witnessed by Mr. Yu, Cheng-Wei, Deputy Director General of IDB, MOEA, Lieutenant Governor Brad Little, and Mr. Vincent Chin Hsiang Yao, Director General of the Taipei Economic and Cultural Office at Seattle. The cooperation will feature various efforts such as joint research, project-based courses, degree certification and exchange of faculties and students to promote exchange and cultivation of Taiwan's talent in smart manufacturing and industrial Internet of things (IIoT).
Founded in 1932, Boise State University is a key educational institute for Micron Technologies headquarters in industry-academia cooperation. The company has donated to establish the Micron Technologies Materials Engineering Institute for cultivating talent in semiconductor materials and process technology. Many high-level executives and engineers of Micron Technologies graduated from the university. Providence University is currently the only university in Taiwan in the International Student Exchange Programs (ISEP), and has very good cooperation relations with the smart machinery and IIoT industries in the Taichung region. This cooperation with Boise State University will accelerate cross-national, cross-disciplinary and cross-industry learning, as the cooperation model with Boise State University will be applied to enable cooperation between Micron Technologies and colleges in Taiwan to cultivate local high-level technical personnel.
Contacts
Contact Organization: Metal and Mechanical Industries Division, Industrial Development Bureau, Ministry of Economic Affairs
Contact Person: Mr. Chang
Contact Phone: (02)2754-1255 ext. 2141
Source: Industrial Development Bureau, MOEA
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